Apparatus for attaching adhesive tape to lead-on-chip leadframes

ABSTRACT

An apparatus for attaching adhesive tape to a leadframe. The apparatus includes: a support frame; an adhesive tape on a reel mounted to the frame; a stationary cutter base mounted to the frame with an opening therethrough having a peripheral outline where the opening receives a leading terminal end of the tape and a portion of the tape following the leading terminal end, a channel in the base to guide the tape into the opening, and a block to hold the tape in the channel and in the opening; and a cutter which moves through the opening to cut a decal from the tape within the opening and to apply the decal to a leadframe. The cutter and the decal having an outline substantially matching the peripheral outline of the opening such that wasted tape is eliminated.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a division of application Ser. No. 08/509,048 filedJul. 31, 1995.

FIELD OF THE INVENTION

This invention relates generally to semiconductor packaging andparticularly to a method and apparatus for cutting and applying adhesivetape to a leadframe for a lead-on-chip semiconductor package.

BACKGROUND OF THE INVENTION

One type of semiconductor package is known as a lead-on-chip (LOC)package. A lead-on-chip package includes a semiconductor dieencapsulated in a polymeric material (e.g., epoxy resin). This packageis formed using a metal leadframe. The leadframe supports several dicefor packaging and provides the leads for the completed package. Aconventional leadframe includes a mounting paddle for each die and leadfingers that are wire bonded to bond pads on the die and then trimmedand formed into leads. However, with a lead-on-chip package, the leadfingers of the leadframe, not only form the leads in the completedpackage, but also support the die during the encapsulation process.

Prior to the encapsulation process, the die is attached to an undersideof the lead fingers. The LOC package provides superior heat transferfrom the die and shortens the length of the bond wires. In addition, theLOC package can be formed with a more reliable seal. U.S. Pat. No.4,862,245 to Pashby et al. and U.S. Pat. No. 4,916,519 to Ward describelead-on-chip semiconductor packages.

A common method of attaching and wire bonding a LOC die to a LOCleadframe is known as area wire bonding, or A-wire bonding. Aconventional A-wire bonding process begins by attaching the die to thelead fingers of the leadframe. For attaching the die to the leadframe, adouble-sided adhesive tape can be used. The tape includes a thermosetadhesive on both sides such as an epoxy, acrylic, silicone or polyimide.This type of tape is sometimes referred to as LOC tape and can alsofunction as an alpha barrier for the die. The LOC tape is initiallyattached to the leadframe using heat and pressure. Then the face of thedie is attached to the LOC tape using heat and pressure and an oven isused to cure the adhesive. After the curing step, the leadframe istransferred to a wirebonder machine where bond wires are attached to thebond pads of the die and to the lead fingers of the leadframe.

Prior to the die attach, the LOC tape must be placed onto the heatedleadframe in a configuration that secures the die to the lead fingersbut allows access to the bond pads of the die for wirebonding.Typically, a single piece of LOC tape is dispensed from a continuousroll of tape and then punched into two decals that are spaced apart andcut away to provide access to the bond pads.

One problem with this process is that LOC tape is an expensive materialand a large amount of tape is wasted during formation of the LOC decals.With a conventional LOC punching apparatus the width of the tape must belarge enough to punch two decals with a space in-between the decals.Typically, the decals are punched from the center of a continuous lengthof tape having a width that is much larger than the peripheraldimensions of the decal. In addition, there is wasted tape across thelength of the tape in an area between the decals for adjacent dice. Insome systems approximately 50 to 75% of the tape is wasted. It would beadvantageous to be able to form a LOC decal without wasting tape.

In view of the foregoing, it is an object of the present invention toprovide an improved method and apparatus for cutting LOC tape intodecals and for applying the cut decals to a leadframe with no wastedtape.

It is yet another object of the present invention to provide an improvedapparatus for cutting LOC tape and for applying the cut decals to aleadframe at production speeds and with no wasted tape.

Other objects, advantages and capabilities of the present invention willbecome more apparent as the description proceeds.

SUMMARY OF THE INVENTION

In accordance with the present invention, an improved method andapparatus for cutting and applying LOC tape to a leadframe with nowasted tape are provided. The decals can then be used for securing asemiconductor die to the leadframe. The method uses one or morecontinuous ribbons of double sided adhesive tape that are cut intodecals and applied in a desired pattern to the leadframe. A finisheddimension (e.g., width) of each decal is the same as a width of thetape. Another finished dimension (e.g., length) of each decal iscontrolled by cutting an indexed length of the tape. Using this methodthere are only two cut edges per decal and only one cut is required foreach index of the tape and leadframe.

The decals are cut and applied in a desired pattern to select portionsof the leadframe, such as to the lead fingers or bus bars of theleadframe. The decals are cut and pressed against the leadframe in acontinuous process in which the tape is indexed to a particular lengthand the leadframe is indexed for application of the cut decals.

An apparatus for performing the method of the invention includes: asupport frame for rotatably mounting one or more reels of double sidedadhesive tape of a desired width; a tape guide for guiding continuousribbons of tape from the reels into guide openings for cutting; a pairof feed rollers for continuously feeding and indexing the ribbons oftape into the guide openings; and a cutter assembly adapted to cutdecals from the ribbons of tape held in the guide openings and to applythe cut decals in a desired pattern to a die mounting area of theleadframe. The leadframe is heated and held against the guide openingsof the cutter assembly by a leadframe handling apparatus. The leadframehandling apparatus also indexes the leadframe to align die mountingareas on the leadframe to the cutter assembly.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a prior art LOC leadframe and LOCsemiconductor die;

FIG. 2 is a side elevation view of a prior art LOC leadframe withseveral semiconductor dice attached thereto;

FIG. 3 is a side elevation view of an apparatus constructed inaccordance with the invention for cutting and applying LOC decals to aLOC leadframe;

FIG. 4A is a plan view of a portion of the apparatus shown in FIG. 3,with components removed, and showing a LOC leadframe having decals beingapplied thereto in accordance with the invention;

FIG. 4B is an end view taken along section line 4A--4A of FIG. 4A;

FIG. 5 is a schematic bottom view of a LOC leadframe superimposed with asemiconductor die and LOC decals cut in accordance with the invention;

FIG. 6 is an exploded view of a portion of apparatus shown in FIG. 3illustrating a tape cutter assembly of the apparatus.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring now to FIGS. 1 and 2, a prior art lead-on-chip (LOC) die 10and lead-on-chip (LOC) leadframe 12 are shown. The LOC die 10 is thin,flat and generally rectangular in shape and includes a die face 14, oractive side, wherein the integrated circuitry is formed. A plurality ofbond pads 16 are formed across the center and edge portions of the die10 in electrical contact with the integrated circuits formed on the die10.

The leadframe 12 is formed from metal sheet and includes side rails 18,20 formed with indexing holes 22. The indexing holes 22 facilitatetransport and handling of the leadframe 12 by automated packagingmachinery. The leadframe 12 also includes sidebars 24, 26 (or dam bars)for increased rigidity. The siderails 18, 20 and sidebars 24, 26 aretrimmed away during a trim and form operation. In addition, theleadframe 12 includes a plurality of generally parallel and spaced leadfingers 28. During the LOC packaging process the lead fingers 28 arebonded to thin bond wires which are also bonded to the bond pads 16 onthe die 10. The lead fingers 28 will ultimately be trimmed and formedinto leads which function to electrically connect the die 10 to theoutside world. However, during the packaging process the lead fingers 28function to support the die and facilitate heat transfer from the die 10during the packaging process. The leadframe 12 can also include bus bars32 for making multiple connections to the bond pads 16. The leadframe 12is formed such that the lead fingers 28 and bus bars 32 form a separatedie mounting area 36 for each die 10.

As shown in FIG. 2, multiple dice 10 are attached to the leadframe 12.Each die 10 is mounted in a die mounting area 36 of the leadframe 12. Asshown in FIG. 1, the dice 10 are attached to the lead fingers 28 usingpunched decals 30. The punched decals 30 are punched from a continuousroll of LOC tape (not shown). The decals 30 are punched with a space 33therebetween to allow access for the bond pads 16 across the center ofthe die 10. In addition, a corner portion 34 of the decals 30 is punchedaway to allow access for the bond pads 16 along the sides of the die 10.As previously explained punching decals 30 in this manner wastes a largeamount of LOC tape.

Referring now to FIGS. 3, 4A, and 4B, a tape cutting apparatus 40constructed in accordance with the invention is shown. The tape cuttingapparatus 40 includes: a support frame 42; a plurality of tape reels 44freely rotatably mounted to the support frame 42 and adapted to supplycontinuous lengths of double side adhesive tape 54 for cutting; a pairof tape feed rollers 46, 48 for feeding and indexing the tape 54 forcutting; a tape guide 50 for guiding the tape 54 for cutting; and a tapecutter assembly 52 for cutting the tape 54 into decals 74 (FIG. 5).

In the illustrative embodiment there are two tape reels 44 for supplyingtwo continuous lengths of tape 54 and two cut decals 74 per die 10.However, depending on the application and the number of decals requiredfor each die 10, the method of the invention can be practiced using agreater or lesser number of tape reels 44.

The support frame 42 includes vertical supports 56 adapted to supportthe tape reels 44 for rotation. The vertical supports 56 include idlerrollers 62 for supporting the tape 54. Each tape reel 44 includes amounting shaft 58 and the vertical supports 56 include bearings 60 forsupporting the mounting shafts 58 for rotation. The mounting shafts 58are removably journaled to the bearings 60 to permit removal andreplacement of the tape reels 44 as the tape 54 on a reel 44 is used up.

The tape 54 includes a substrate formed of a flexible polymeric materialcoated on both sides with an adhesive. By way of example and notlimitation, one suitable tape 54 is Hitachi HM 122U tape manufactured byHitachi Chemical Co. LTD. This tape has an overall thickness of about0.0035" and is coated with about a 0.0008" thick layer of adhesive onboth sides. A width of the tape 54 is the same as the finished width ofthe cut decals 74. Accordingly, the width of the tape 54 is selected toform decals 74 with a finished width to cover a select portion of thelead frame 12. In the illustrative embodiment the decals 74 cover justthe tip portion (i.e., terminal end) of the lead fingers 28 of theleadframe 12 in a particular die mounting area 36. Alternately the widthof the tape 54 and placement of the decals 74 can be selected to coverother desired portions of the leadframe 12.

The tape feed rollers 46, 48 are rotatably mounted on an upper rollermount 66 and a lower roller mount 68 respectively. The tape feed rollers46, 48 are drivably connected to stepper motors (not shown) adapted todrive the tape feed rollers 46, 48 through predetermined complete orpartial revolutions. Each revolution or partial revolution of the tapefeed rollers 46, 48 moves the tape 54 a corresponding linear amount. Theupper tape feed roller 48 is spring loaded in the vertical direction topermit tensioning of the tape 54 as required. In this manner the tapefeed rollers 46, 48 can feed or index a predetermined length of tape 54through the tape guide 50 and into the tape cutter assembly 52 forcutting.

The tape guide 50 is formed with a guide channel 70 for receiving thetape 54 from each tape reel 44. In addition, the guide channel 70 isadapted to maintain a precise spacing and parallel orientation of theribbons of tape 54 as they are fed and indexed by the tape feed rollers46, 48 into the tape cutter assembly 52. In FIG. 4 the upper rollermount 66 and tape feed roller 48 are cut away to show the confinement ofthe tape 54 within the guide channel 70. The tape 54 is fully enclosedby the guide channel 70 from a point just upstream of the tape feedrollers 46, 48 to the tape cutter assembly 52. As will be furtherexplained, the tape cutter assembly 52 is also configured to enclose andguide the tape 54 for cutting.

At the same time that the ribbons of tape 54 are fed into the tapecutter assembly 52, the leadframe 12 is also fed and indexed into tapecutter assembly 52. The relative position of the leadframe 12 withrespect to the ribbons of tape 54 is clearly shown in FIG. 4A. Ingeneral, an orientation and direction of movement 120 of the leadframe12 is generally perpendicular to the orientation and direction ofmovement 114 of the ribbons of tape 54. The leadframe 12 is indexed intothe tape cutter assembly 52 such that one die mounting area 36 (FIG. 5)at a time is positioned for the simultaneous application of the cutdecals 74 (FIG. 5).

The leadframe 12 is fed and indexed into the tape cutter assembly 52using a leadframe handling apparatus 72 (FIG. 4B). One suitableleadframe handling apparatus 72 is manufactured by ESC ManufacturingCompany, Warrington, Pa. and is designated an ESC Apollo 9200 LOC dieattach system. As shown in FIG. 4B, the leadframe handling apparatus 72includes guide members 73 for guiding the leadframe 12. The leadframehandling apparatus 72 also includes an indexer walk beam (not shown) forindexing the leadframe 12 to a location for applying the cut decals 74.As also shown in FIG. 4B, the leadframe handling apparatus 72 includes aheat block 75 to provide the heat necessary to activate the adhesive onthe tape 54 and to hold the leadframe 12 down as the decals 74 areapplied by the tape cutter assembly 52.

The tape cutter assembly 52 is adapted to cut the decals 74 (FIG. 5)from the ribbon of tape 54 and to press the cut decals 74 against theheated leadframe 12. In a subsequent step (not shown) the die 10 will bepressed against the decals 74 for securing the die 10 to the leadframe12. FIG. 5 shows the relative locations of the decals 74 after being cutand pressed by the tape cutter assembly 52 to the leadframe 12. In FIG.5, the dotted rectangle represents the die mounting area 36. The decals74 are generally rectangular shaped and are secured to the underside ofthe leadframe 12 in the die mounting area 36. In the illustrativeembodiment a pair of decals 74 are applied to the leadframe 12.Alternately a greater or lesser number of decals 74 can be applied tothe leadframe 12. Furthermore, the decals 74 can be applied to otherportions of the leadframe 12 such as to bus bars or to connectingportions of the leadframe formed and placed specifically for attachingthe die 10 to the leadframe 12.

In FIG. 5, the "X" dimension represents the finished width of arectangular shaped decal 74. The "Y" dimension represents the finishedlength of the rectangular shaped decal 74. By way of example and notlimitation, Table 1 provides exemplary dimensions for the decals 74, die10 and spacing from reference points (0) on the leadframe 12.

                  TABLE 1                                                         ______________________________________                                        Dimensions in Inches                                                          Die Size  "X" (TAPE)                                                                              "Y" (TAPE) "A"  "B"   "C"                                 ______________________________________                                        0.262 × 0.569                                                                     0.047     0.551      0.340                                                                              0.360 0.870                               0.445 × 0.723                                                                     0.120     0.693      0.430                                                                              0.450 1.370                               ______________________________________                                    

As also clearly shown in FIG. 5, the cut decals 74 are located generallyparallel to one another and spaced apart by a distance sufficient toprovide access to the bond pads 16 on the die 10. As indicated by theabove table, the spacing between the cut decals can be on the order ofabout 0.030" but can be more or less as required. In addition, asclearly shown in FIG. 5, the cut decals 74 have a finished width "X"that is wide enough to cover just the tip portions of the lead fingers28 of the leadframe 12. The finished width of the cut decals 74 isdetermined solely by the width of the tape 54. The finished length "Y"of the cut decals 74 is determined by the indexing and cutting steps.Thus only one cut edge per decal is formed for each index of the tape 54and leadframe 12. Alternately this system can be rotated 90° such that afinished length of the decals 74 is determined by a width of the tape 54and a finished width of the decals 74 is determined by the cutting step.

Referring now to FIG. 6, components of the tape cutter assembly 52 areshown in an exploded view. The tape cutter assembly 52 includes a cutterbase 80; a pair of tape cutters 82 mounted for reciprocal movement withrespect to the cutter base 80; and a pair of guide openings 99 foraligning the tape 54 with the tape cutters 82 for cutting.

The cutter base 80 is formed as a solid metal block and includesdovetails 84 on either side for attachment to the tape guide 50 (FIG. 3)and to a mounting block 86 (FIG. 3) of the support frame 42. The cutterbase 80 also includes separate entrance channels 88 separated by apartition 89. The entrance channels 88 are sized for receiving andmaintaining separation of the ribbons of tape 54. A tape lead-in member90 attaches to the cutter base 80 to cover the entrance channels 88 andform spaced rectangular passages separated by the partition 89.

A rectangular groove 92 is formed in the cutter base 80 wherein a cutterblock 94 is mounted. The tape 54 is guided by the entrance channels 88under the lead-in member 90 and under the cutter block 94. As clearlyshown in FIG. 4B, the lead-in member 90 is tapered to guide the tape 54under the cutter block 94. The cutter block 94 is adapted to hold theuncut ribbons of tape 54 down as the decals are simultaneously cut andpressed against the leadframe 12.

The guide openings 99 for the cut decals 74 extend through the fullthickness of the cutter base 80. The guide openings 99 are adapted toalign the tape 54 with the tape cutters 82 and to align the cut decals74 with the leadframe 12. As clearly shown in FIG. 4B, the tape cutters82 are adapted to move through the guide openings 99 to cut the tape 54held down by the cutter block 94. Furthermore, the tape cutters 82 areadapted for movement past an upper surface 97 of the cutter base 80 topress the cut decals 74 against the leadframe 12 held against the heatblock 75 of the leadframe handling apparatus 72. The tape cutters 82include vacuum passages 118 (FIG. 6) in flow communication with a vacuumconduit 119 (FIG. 4B). The vacuum passages 118 apply a vacuum force tothe decals 74 for securing the cut decals 74 to the tape cutters 82 asthe cutters 82 are extended to press the decals 74 against the leadframe12. The vacuum conduit 119 (FIG. 4B) is in flow communication with avacuum source (not shown) and suitable control valves (not shown) foreffecting cycling of the vacuum to the vacuum passages 118 as required.

A peripheral outline of the decals 74 matches the peripheral outline ofthe end surfaces 116 of the tape cutters 82 and also the peripheraloutline of the guide openings 99. In the illustrative embodiment thedecals 74 have a generally rectangular peripheral shape. However, otherperipheral shapes such as a square are also possible. Depending on thedimensions of the leadframe 12 and die 10, the tape cutters 82 and guideopenings 99 can be dimensioned as required.

As shown in FIG. 6, the tape cutters 82 are attached to a mounting plate96 and to a mounting shoe 98. A dowel pin 100 secures the tape cutters82 to one another and to the mounting plate 96. The mounting shoe 98includes a rectangular opening 102 for the tape cutters 82. Sleevebearings 104 are attached to the mounting shoe 98 and mounting plate 96and slide over guide posts 106 attached to the cutter base 80. Retainingrings 108 are attached to the guide posts 106 to prevent the sleevebearings 104 from sliding off the guide posts 106. The assembled tapecutter assembly 52 is clearly shown in FIGS. 3 and 4B.

The tape cutters 82 are formed with sharp, burr-free cutting edges 110for cutting the ribbons of tape 54. In addition, the tape cutters 82include a finished surface (e.g., 8 micro inches). The guide openings 99in the mounting shoe 98 are also formed with finished surfaces. Thelocation of the tape cutters 82 with respect to the cutter block 94 iscontrolled by the guide openings 99 in the cutter base 80. Therefore theclearance between the tape cutters 82 and the guide openings 99 must beas small as possible but still maintain free sliding movement of thetape cutters 82 through the guide openings 99.

The mounting plate 96, mounting shoe 98 and tape cutters 82 are adaptedto be driven up and down on the guide posts 106 by a hydraulic cylinderor other actuator (not shown). By way of example and not limitation, areciprocating speed for the tape cutters 82 is on the order of 40strokes per minute.

OPERATION

As shown in FIG. 3, during the operation of the tape cutting apparatus40, the tape feed rollers 46, 48 unwind the tape reels 44 in thedirections indicated by rotational arrow 112. The ribbons of tape 54move in a linear direction 114. The ribbons of tape 54 are driven by thetape feed rolls 46, 48 through the tape guide 50 and into the entrancechannels 88 (FIG. 6) in the tape cutter assembly 52.

Indexing of the ribbons of tape 54 by the tape feed rolls 46, 48 is suchthat the tape 54 fills the guide openings 99 (FIG. 6) in the cutter base80. The amount the tape 54 is indexed and size of the guide openings 99are selected to provide a desired finished length for the cut decals 74.With a die mounting area 36 of the leadframe 12 positioned over theguide openings 99, the tape cutters 82 are actuated to cut the tape 54to form the decals 74. At the same time that the edge 110 (FIG. 6) ofthe tape cutters 82 cuts the decals 74, the end surfaces 116 (FIG. 6) ofthe tape cutters 82 press the decals 74 against the heated leadframe 12.The vacuum passages 118 function to attach the decals 74 to the surface116 of the cutters 82 as the decals 74 are pressed against the leadframe12.

Once the decals 74 are cut and pressed against the leadframe 12, thetape cutters 82 are retracted. The lead frame 12 is then indexed toposition another die mounting area 36 of the leadframe 12 over the guideopenings 99 in the cutter base 80. The above sequence is then repeatedfor forming and pressing decals 74 against the adjacent die mountingarea.

Thus the invention provides an improved method and apparatus for cuttingand applying double side adhesive tape to a leadframe. While theinvention has been described with reference to certain preferredembodiments, as will be apparent to those skilled in the art, certainchanges and modifications can be made without departing from the scopeof the invention as defined by the following claims.

What is claimed is:
 1. An apparatus for attaching adhesive tape to aleadframe comprising:a support frame; an adhesive tape at leastpartially contained on a reel rotatably mounted to the support frame; apair of feed rollers attached to the support frame and configured toindex the tape; a stationary cutter base mounted to the support framecomprising an opening therethrough having a peripheral outline andconfigured to receive a leading terminal end of the tape and a portionof the tape following the leading terminal end, a channel thereinconfigured to guide the tape into the opening, and a block proximate thechannel configured to hold the tape in the channel and in the opening;and a cutter configured to move through the opening to cut a decal fromthe tape within the opening and to apply the decal to the leadframe, thecutter and the decal having an outline substantially matching theperipheral outline of the opening.
 2. The apparatus of claim 1 furthercomprising a lead in member on the channel configured to guide the tapethrough the channel into the opening.
 3. The apparatus of claim 1further comprising a second channel in the base, a second openingthrough the base having the peripheral outline, and a second cutterconfigured to move through the second opening to cut a second decal froma second portion of a second tape held within the second opening wherethe second decal has a second decal outline substantially matching theperipheral outline and to apply the second decal to the leadframe. 4.The apparatus of claim 1 further comprising a leadframe handlingapparatus for positioning the leadframe proximate to the opening.
 5. Anapparatus for attaching adhesive tape to a leadframe comprising:asupport frame; a first adhesive tape at least partially contained on afirst reel and and a second adhesive tape at least partially containedor a second reel, the first reel and the second reel rotatably mountedto the support frame; a cutter assembly on the support frame, the cutterassembly comprising:a stationary cutter base; a first opening throughthe base having a first peripheral outline and configured to receive afirst leading terminal end of the first tape and a portion of the firsttape following the first leading terminal end for cutting; a secondopening through the base having a second peripheral outline andconfigured to receive a second leading terminal end of the second tapeand a portion of the second tape following the second leading terminalend for cutting; a first cutter configured to move through the firstopening to cut a first decal from the first tape within the firstopening and to apply the first decal to the leadframe, the first cutterand first decal having a first outline substantially matching the firstperipheral outline; a second cutter configured to move through thesecond opening to cut a second decal from the second tape within thesecond opening and to apply the second decal to the leadframe, thesecond cutter and the second decal having a second outline substantiallymatching the second peripheral outline.
 6. The apparatus of claim 5,wherein the first peripheral outline and the second peripheral outlineare generally rectangular shaped.
 7. An apparatus for attaching adhesivetape to a leadframe comprising:a support frame comprising a first guidechannel; a feed mechanism on the support frame configured to move anadhesive tape through the first guide channel; a stationary cutter basemounted to the support frame comprising a second guide channel in thebase, a block on the second guide channel, and an opening through thebase having a peripheral outline, the second guide channel and the blockconfigured to enclose and guide a leading terminal end of the tape and aportion of the tape following the leading terminal end into the openingand to hold the tape during cutting of the within the opening; and acutter configured to move through the opening to cut a decal from thetape within the opening and to apply the decal to the leadframe, thecutter and the decal having an outline substantially matching theperipheral outline of the opening such that the decal can be alignedwith the leadframe and with the cutter by the opening.
 8. The apparatusof claim 7 further comprising a third guide channel in the base, asecond block proximate the third guide channel, a second opening throughthe base, and a second cutter configured to move through the secondopening to cut a second decal from a second portion of a second tapeheld within the second opening where the second decal has a second decaloutline substantially matching the peripheral outline and to apply thesecond decal to the leadframe.
 9. The apparatus of claim 7 wherein thecutter comprises a vacuum passage for attaching the decal to the cutter.10. An apparatus for attaching adhesive tape to a leadframe comprising:asupport frame; a feed mechanism on the support frame configured to movea first adhesive tape and a second adhesive tape along the supportframe; a stationary cutter base mounted to the support frame comprisingspaced first and second guide channels in the base, a block on thechannels, and a pair of spaced first and second openings through thebase where the first opening has a first peripheral outline and thesecond opening has a second peripheral outline, the channels and theblock configured to (a) enclose and guide a first leading terminal endof the first tape and a portion of the first tape following the firstleading terminal end into the first opening, (b) enclose and guide asecond leading terminal end of the second tape and a portion of thesecond tape following the second leading terminal end into the secondopening, (c) hold the first tape during cutting of the first tape withinthe first openings, and (d) hold the second tape during cutting of thesecond tape within the second opening; a first cutter configured to movethrough the first opening to cut a first decal from the first tapewithin the first opening and to apply the first decal to the leadframe,the first cutter and the first decal having an outline substantiallymatching the first peripheral outline such that the first decal can bealigned with the leadframe and with the first cutter by the firstopening; and a second cutter configured to move through the secondopening to cut a second decal from the second tape within the secondopening and to apply the second decal to the leadframe, the secondcutter and the second decal having an outline substantially matching thesecond peripheral outline such that the second decal can be aligned withthe leadframe and with the second cutter by the second opening.
 11. Theapparatus of claim 10 wherein the first cutter and the second cuttereach comprise a vacuum passage.